Utility Aspects of Heat Resistant Potting Compound

In this digital age of electronic revolution, the use of microelectronic devices (like semiconductor) has increased more than ever before. To protect these products from the external attacks of environmental substances like moisture, air, water, a specific type of liquid plastic or rubber material is encased on them. This plastic or rubber liquid material is known as potting compound.

As it encapsulates an electronic and electronic component product, it is called by its other name encapsulants. It not only keeps electronic goods and electrical components off environmental attacks, but also strengthens them not to be affected by heat and other and physical stroke that may cause damage to them.  The liquid consists of two parts. One is a resin and the other hardener or accelerator. They are mixed in a right proportion (to give uniformity) and let for de-aired under a certain reduced pressure. Potting compound may be off various types such as silicone, polyurethane, Epoxy, and thermal potting compound. The other type of it encompasses UV compounds and other heat hardening materials. Polyester and hot melt potting compounds are the prominent example of this genre.

Many industries have their wide use of potting compounds as an excellent choice for high volume applications. To solidify a material and prevent it from the inside, there is nothing better or parallel like heat resistant potting compound.

These thermal potting compounds are popularly known as heat resistant potting compound. They are heat resistant and highly useful for commercial uses. These are specifically aimed for ambient cured or temperature accelerated potting applications. It can offer a resilient finished product with 180C performance.

Now have a quick glance at the salient features of heat resistant potting compounds

• The right and exact cure speed at a reasonable cure temperature
• Low thickness, durability and long pot life at application temperature
• Super thermal stability
• A perfect union and compatibility with all surfaces of substrates
• Needs low stress particularly at the time of using at ceramic base or substrates board
• It is resistance to filler settling
• Comprises of good electrical insulating properties
• They are extensively used in thermally conductive compounds specifically which are very effective and sensitive in controlling heat.

Its invention and introduction has helped our civilization run smoothly in the age of digital explosion. Its use has added a different dimension in modern civilization. Heat resistant potting compound surely has a chance to gorge on the goodies.